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Our commitment to quality and innovation never rests.
Since 1994, Megaforce Corporation has stayed on the leading edge of printed circuit board assembly (PCBA) and subsystems manufacturing by utilizing the most advanced assembly technologies and processes available. From high-volume, low-complexity boards to low-volume, high complex boards, our production team stays ahead of the competition by continuously improving upon and installing new assembly capabilities and manufacturing processes.
We work with our customers and suppliers to anticipate technology trends and quality assembly methods for new component packages, such as micro-BGAs (Ball Grid Array) and other products. We are at the forefront in developing lead-free manufacturing techniques to help our customers comply with new environmental regulations.
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- Surface Mount Technology (SMT)
- Pin Through Hole (PTH)
- Intrusive Reflow
- Package-on-Package (POP)
- Chip Scale Package (CSP)
- Ball Grid Array (BGA, uBGA)
- Fine Pitch Devices (QFP, 0.3mm)
- Miniature Components (01005s)
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- Tin-Lead & Lead-Free (RoHS) Assembly
- Nitrogen (N2) Reflow Process
- Wire-bonding
- Press-fit
- Wave Solder
- Selective Soldering
- Chemical and Aqueous cleaning
- Various PCB Surface Finishes (HASL, ENIG, IS, OSP)
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- Aegis Manufacturing Operations Software
- CAD-Intelligent Visual Aids
- Process Planning & Launch
- Paperless Shop Floor Environment
- Real-Time Process Tracking & Control
- Process Terminal & Attendant (inForce)
- Live Monitoring of Factory Performance (Dashboards)
- Real-Time Statistical Process Control (SPC)
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With over 15 years of experience, Megaforce understands the unique challenges and requirements of each market sector.
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